When: |
25 May through 26 May 2020 | |
CFP Deadline: |
13 |
|
Where: |
Osaka, Japan, Japan | |
Website URL: |
https://materialsscience.conferenceseries.com/asia-pacific/ | |
Sponsoring organization: |
Conferenceseries.com | |
Categories: |
Engineering & Technology - Material/Nanotechnology |
Keywords:
Event description:
20th International Conference on Materials Science and Engineering, scheduled during May 25-26, 2020 at Osaka, Japan, is a full-day event being curated by eminent speakers, scientists, students, and other audiences. Our goal is to bring together bright minds to give talks that are idea-focused, and on a wide range of subjects to learn, inspire and provoke conversations.
Posting date:
14 December 2019 | 200 views
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