SEP 10

2018 7th International Conference on Engineering and Innovative Materials (ICEIM 2018)--Ei Compendex,Scopus

ICEIM 2018   

Conference CFP

  

 

When:

  10 Sep 2018 through 12 Sep 2018

CFP Deadline:

  20 May 2018

Where:

  Kitakyushu, Japan

Website URL:

  http://www.iceim.org/

Sponsoring organization:

  ICEIM 2018

Categories:

  Engineering & Technology > Material/Nanotechnology

Cloud tags:

Event description:

**Publication: All the registered and presented papers will be published by Defect and Diffusion Forum by TTP press, and then will submit for Ei Compendex and Scopus index. **History: ICEIM has been held in Phnom Penh, Cambodia (2012), Shanghai, China (2013), Kuala Lumpur, Malaysia (2014), Penang, Malaysia (2015), Kuala Lumpur, Malaysia (2016), Kokushikan University, Tokyo, Japan (2017) successfully. Proceedings of ICEIM 2014, ICEIM 2015 and ICEIM 2016 have been indexed by Ei Compendex and Scopus. **Submission Methods: 1. Full Paper(publication and oral presentation) 2. Abstract(oral presentation only) Please submit your paper or abstract via Electronic Submission System (.pdf) http://www.easychair.org/conferences/?conf=iceim2018 **Contacts: Ms. Sukie Yao E-mail: iceim_conf@vip.163.com Tel: +86-18381008370

Posting date:

12 April 2018
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