JAN 24

Hong Kong International Conference on Engineering and Applied Sciences

   

Conference CFP

  

 

When:

  24 Jan 2018 through 26 Jan 2018

CFP Deadline:

  21 Sep 2017

Where:

  , Hong Kong

Website URL:

  http://hkiceas.org/site/page.aspx?pid=901&sid=6053&lang=en

Sponsoring organization:

  Higher Education Forum (HEF)

Categories:

  Engineering & Technology > Other

Event description:

Organized by Higher Education Forum (HEF), Hong Kong International Conference on Engineering and Applied Sciences (HKICEAS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields of Engineering and Applied Sciences. 2018 HKICEAS will take place from January 24-26, 2018 in Hong Kong. Prospective authors are invited to submit original research abstracts or full papers which were not, are not and have not been submitted/published/under consideration in other conferences and journals.

Posting date:

29 May 2017
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